Welcome to Hotenda.com Online Store!

logo
userjoin
Home

IS61LF51236A-7.5B3

IS61LF51236A-7.5B3

IS61LF51236A-7.5B3

ISSI, Integrated Silicon Solution Inc

2.5/3.33.3V V 165 Pin Memory IC 15mm mm

SOT-23

IS61LF51236A-7.5B3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES
Number of Pins 165
Operating Temperature 0°C~70°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature PIPELINED ARCHITECTURE, FLOW-THROUGH
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 2.5/3.33.3V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 18Mb 512K x 36
Memory Type Volatile
Clock Frequency 117MHz
Supply Current-Max 0.24mA
Access Time 7.5ns
Memory Format SRAM
Memory Interface Parallel
Organization 512KX36
Output Characteristics 3-STATE
Memory Width 36
Standby Current-Max 0.06A
Memory Density 18874368 bit
I/O Type COMMON
Standby Voltage-Min 3.14V
Height Seated (Max) 1.2mm
Length 15mm
Width 13mm
RoHS Status ROHS3 Compliant
IS61LF51236A-7.5B3 Product Details

IS61LF51236A-7.5B3 Overview


There is a memory type Volatile for this type of device. The case comes in Tray size. An embedded 165-TBGA case surrounds memory ics. On the chip, there is an 18Mb 512K x 36 memory, which is the size of the chip's memory. This device utilizes a SRAM format memory which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. It is supplied votage within 3.135V~3.465V. The recommended mounting type for this device is Surface Mount. 165 terminations are planted on the chip. The comprehensive working procedure is supported by 1 functions in this part. The memory device is designed to be supplied with an 3.3V volt power supply in order to operate properly. In the memory, there is a clock frequency rotation that ranges 117MHz. A 165-pin package containing this memory device is used to house this device. I have noticed that the memory device has 165 pins, which indicates that it has 165 locations in the memory. Although it has all the merits this chip has, it is also equipped with PIPELINED ARCHITECTURE, FLOW-THROUGH to give a performance boost to the system. This memory chip requires only 2.5/3.33.3V of power. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. As far as the supply current is concerned, it can be operated with a maximum of 0.24mA of current

IS61LF51236A-7.5B3 Features


Package / Case: 165-TBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE, FLOW-THROUGH
I/O Type: COMMON

IS61LF51236A-7.5B3 Applications


There are a lot of ISSI, Integrated Silicon Solution Inc IS61LF51236A-7.5B3 Memory applications.

  • eDRAM
  • supercomputers
  • telecommunications
  • printers
  • embedded logic
  • networking
  • cell phones
  • Camcorders
  • personal computers
  • main computer memory

Related Part Number

Get Subscriber

Enter Your Email Address, Get the Latest News