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IS61LPS12836A-200B3I

IS61LPS12836A-200B3I

IS61LPS12836A-200B3I

ISSI, Integrated Silicon Solution Inc

2.5/3.33.3V V 165 Pin Memory IC 15mm mm

SOT-23

IS61LPS12836A-200B3I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Reach Compliance Code compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
JESD-30 Code R-PBGA-B165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 2.5/3.33.3V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 4Mb 128K x 36
Memory Type Volatile
Clock Frequency 250MHz
Supply Current-Max 0.21mA
Access Time 2.6ns
Memory Format SRAM
Memory Interface Parallel
Organization 128KX36
Output Characteristics 3-STATE
Memory Width 36
Standby Current-Max 0.075A
Memory Density 4718592 bit
I/O Type COMMON
Standby Voltage-Min 3.14V
Height Seated (Max) 1.2mm
Length 15mm
Width 13mm
RoHS Status Non-RoHS Compliant
IS61LPS12836A-200B3I Product Details

IS61LPS12836A-200B3I Overview


In this case, the memory type of the device can be classified as Volatile. In addition, memory ics is available in a Tray case as well. Embedded in the 165-TBGA case, memory ics is a single file. Memory size on the chip is 4Mb 128K x 36. In this device, the memory is of the SRAM-format, which is a popular format in the mainstream computing sector. A wide operating temperature range makes this device ideal for a variety of demanding applications. It is supplied votage within 3.135V~3.465V. There is a recommendation that Surface Mount mounting type should be used for this product. The chip contains 165 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to power this memory device, 3.3V will be necessary. The memory has a clock frequency rotation within 250MHz. It is worth noting that this memory device has 165 pins, which indicates it has 165 memory locations. While this memory chip features many merits, it also offers PIPELINED ARCHITECTURE for improving system performance. This memory chip requires only 2.5/3.33.3V of power. I/O port addresses on this device are mapped to memory addresses of COMMON bits. It is able to operate from a max supply current of 0.21mA.

IS61LPS12836A-200B3I Features


Package / Case: 165-TBGA
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON

IS61LPS12836A-200B3I Applications


There are a lot of ISSI, Integrated Silicon Solution Inc IS61LPS12836A-200B3I Memory applications.

  • workstations,
  • embedded logic
  • cell phones
  • eDRAM
  • hard disk drive (HDD)
  • multimedia computers
  • networking
  • personal computers
  • data buffer
  • supercomputers

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