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IS61NLP102418-200B3

IS61NLP102418-200B3

IS61NLP102418-200B3

ISSI, Integrated Silicon Solution Inc

2.5/3.33.3V V 165 Pin Memory IC 15mm mm

SOT-23

IS61NLP102418-200B3 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES
Number of Pins 165
Operating Temperature 0°C~70°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 2.5/3.33.3V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 18Mb 1M x 18
Memory Type Volatile
Clock Frequency 200MHz
Supply Current-Max 0.425mA
Access Time 3.1ns
Memory Format SRAM
Memory Interface Parallel
Organization 1MX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.06A
Memory Density 18874368 bit
I/O Type COMMON
Standby Voltage-Min 3.14V
Height Seated (Max) 1.2mm
Length 15mm
Width 13mm
RoHS Status ROHS3 Compliant
IS61NLP102418-200B3 Product Details

IS61NLP102418-200B3 Overview


Volatile is its memory type. Tray-cases are available. 165-TBGA case encloses it. A memory chip with a capacity of 18Mb 1M x 18 is used on this device. This device uses a SRAM-format memory, which is of mainstream design. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. The device is capable of handling a supply voltage of 3.135V~3.465V volts. Its recommended mounting type is Surface Mount. The chip has 165 terminations. It supports up to 1 functions for comprehensive operation. An 3.3V supply is required for this ic memory chip to operate properly. A clock frequency rotation within 200MHz is used for the ic memory chip to rotate data. The ic memory chip comes in a package with 165 pins that allows it to be connected to a computer. It is worth noting that this memory device has 165 pins, which indicates it has 165 memory locations. It also features PIPELINED ARCHITECTURE to boost system performance despite all its merits. In terms of power requirements, this memory chip uses only 2.5/3.33.3V . I/O port addresses on this device are mapped to memory addresses of COMMON bits. With a maximum supply current of 0.425mA , it is able to operate from a variety of supplies.

IS61NLP102418-200B3 Features


Package / Case: 165-TBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON

IS61NLP102418-200B3 Applications


There are a lot of ISSI, Integrated Silicon Solution Inc IS61NLP102418-200B3 Memory applications.

  • personal digital assistants
  • Cache memory
  • cell phones
  • networks
  • telecommunications
  • hard disk drive (HDD)
  • nonvolatile BIOS memory
  • DVD disk buffer
  • eDRAM
  • graphics card

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