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IS61NVF102418-7.5B3I

IS61NVF102418-7.5B3I

IS61NVF102418-7.5B3I

ISSI, Integrated Silicon Solution Inc

2.5V V 165 Pin Memory IC 15mm mm

SOT-23

IS61NVF102418-7.5B3I Datasheet

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Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES
Number of Pins 165
Operating Temperature -40°C~85°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature FLOW-THROUGH ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 2.5V
Supply Voltage-Min (Vsup) 2.375V
Memory Size 18Mb 1M x 18
Memory Type Volatile
Clock Frequency 117MHz
Supply Current-Max 0.425mA
Access Time 7.5ns
Memory Format SRAM
Memory Interface Parallel
Organization 1MX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.075A
Memory Density 18874368 bit
I/O Type COMMON
Standby Voltage-Min 2.38V
Height Seated (Max) 1.2mm
Length 15mm
Width 13mm
RoHS Status ROHS3 Compliant
IS61NVF102418-7.5B3I Product Details

IS61NVF102418-7.5B3I Overview


Its memory type can be classified as Volatile. In addition, memory ics is available in a Tray case as well. An embedded 165-TBGA case surrounds memory ics. 18Mb 1M x 18 is the chip's memory size. In this device, the memory is of the SRAM-format, which is a popular format in the mainstream computing sector. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. It is supplied votage within 2.375V~2.625V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 165 terminations that are planted. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 2.5V will be necessary. In this memory, the clock frequency rotation is within an 117MHz range. A 165-pin package containing this memory device is used to house this device. It is worth noting that this memory device has 165 pins, which indicates it has 165 memory locations. While this memory chip features many merits, it also offers FLOW-THROUGH ARCHITECTURE for improving system performance. When it comes to power supplies, this memory chip only requires 2.5V . In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. This device can be operated from a maximum supply current of 0.425mA under ideal conditions.

IS61NVF102418-7.5B3I Features


Package / Case: 165-TBGA
165 Pins
Additional Feature:FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON

IS61NVF102418-7.5B3I Applications


There are a lot of ISSI, Integrated Silicon Solution Inc IS61NVF102418-7.5B3I Memory applications.

  • multimedia computers
  • workstations,
  • embedded logic
  • Cache memory
  • main computer memory
  • networks
  • eDRAM
  • hard disk drive (HDD)
  • mainframes
  • servers

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