DNA30EM2200PZ-TRL

new-10%

Manufacturer part number:DNA30EM2200PZ-TRL

Manufacturer:IXYS

Description:DIODE GEN PURP 2.2KV 30A TO263

Case Package:SOT-23

Datasheet:DNA30EM2200PZ-TRL Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Surface Mount	YES
Diode Element Material	SILICON
Packaging	Tape & Reel (TR)
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	2
Additional Feature	LOW LEAKAGE CURRENT, PD-CASE
Terminal Position	SINGLE
Terminal Form	GULL WING
Base Part Number	DNA30EM2200
Reference Standard	IEC-60747
JESD-30 Code	R-PSSO-G2
Operating Temperature (Max)	150°C
Number of Elements	1
Configuration	SINGLE
Power Dissipation-Max	210W
Speed	Standard Recovery >500ns, > 200mA (Io)
Diode Type	Standard
Current - Reverse Leakage @ Vr	40μA @ 2200V
Voltage - Forward (Vf) (Max) @ If	1.26V @ 30A
Case Connection	ANODE
Operating Temperature - Junction	-55°C~150°C
Output Current-Max	30A
Application	HIGH VOLTAGE
Voltage - DC Reverse (Vr) (Max)	2200V
Current - Average Rectified (Io)	30A
Number of Phases	1
Rep Pk Reverse Voltage-Max	2200V
Capacitance @ Vr, F	7pF @ 700V 1MHz
Non-rep Pk Forward Current-Max	340A
Reverse Current-Max	40μA
RoHS Status	ROHS3 Compliant