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CPC7584BBTR

CPC7584BBTR

CPC7584BBTR

IXYS Integrated Circuits Division

Telecom device1 Circuits

SOT-23

CPC7584BBTR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Supplier Device Package 16-SOIC
Operating Temperature -40°C~110°C
Packaging Tape & Reel (TR)
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 110°C
Min Operating Temperature -40°C
Power (Watts) 10mW
Max Power Dissipation 10mW
Voltage - Supply 4.5V~5.5V
Function Line Card Access Switch
Number of Circuits 1
Operating Supply Current 1.3mA
Current - Supply 1.3mA
RoHS Status RoHS Compliant
Lead Free Lead Free
CPC7584BBTR Product Details

CPC7584BBTR Overview


To save board space, the 16-SOIC (0.295, 7.50mm Width) package is used.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.The telecom IC is composed of 1 circuits.Telecom circuit is possible to increase efficiency by providing 4.5V~5.5V with a higher voltage.-40°C~110°C is the operating temperature that can be set for reliable performance.In Surface Mount's direction, telecom switching is mounted.Wit h a supply current of 1.3mA, telecom equipment operates.Telecom product operates with the supply current of 1.3mA to provide much flexibility for designers.In order to ensure normal operation, the temperature is set to the minimum value of -40°C.110°C is set to the maximum value to ensure normal operation.

CPC7584BBTR Features


Available in the 16-SOIC (0.295, 7.50mm Width) package
Operating supply current of 1.3mA

CPC7584BBTR Applications


There are a lot of IXYS Integrated Circuits Division CPC7584BBTR Telecom applications.

  • Remote wireless modules
  • PCM Test Equipment
  • Voice over IP/DSL
  • Cable PC
  • Public switching systems
  • ISDN terminal adapter
  • Add/Drop multiplexers (ADMs)
  • M13 MUX
  • Integrated Access Devices
  • High-Density T1/E1/J1 interfaces for Multiplexers

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