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XS170P

XS170P

XS170P

IXYS Integrated Circuits Division

Telecom device2 Circuits

SOT-23

XS170P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SMD, Gull Wing
Supplier Device Package 8-Flatpack
Operating Temperature-40°C~85°C
PackagingTube
Published 2001
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Gull Wing
Max Operating Temperature85°C
Min Operating Temperature -40°C
Power (Watts) 800mW
Max Power Dissipation800mW
Function Relay Switch
Number of Circuits 2
Throw Configuration SPST
Input Current 50mA
Height 2.159mm
Length 9.652mm
Width 6.35mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:1369 items

XS170P Product Details

XS170P Overview


To save board space, the 8-SMD, Gull Wing package is used.The way of Tube is employed for telecommunications equipment packing.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 2 circuits.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.Telecom switching is mounted in the way of Surface Mount.Ensure normal operation by setting the temperature to -40°C minimum.85°C is set to the maximum value to ensure normal operation.

XS170P Features


Available in the 8-SMD, Gull Wing package

XS170P Applications


There are a lot of IXYS Integrated Circuits Division XS170P Telecom applications.

  • Fault Tolerant Systems
  • PDH Multiplexers
  • PBX interfaces
  • Central office
  • CSU/DSU E1/T1/J1 Interface
  • Frame Relay Switches and Access Devices (FRADS)
  • Cable Modem
  • CSU/DSU E1 Interface
  • LAN Routers
  • Wireless local loop (WLL)

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