FI Series 2-Row Receptacle Solder Copper Alloy Tape & Reel (TR) Surface Mount, Right Angle Gold Polyphenylene Sulfide (PPS), Glass Filled 21-Position Board to Cable/Wire 0.146 3.70mm He
SOT-23
FI-W21P-HFE-E1500 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Contact Material
Copper Alloy
Mount
Surface Mount
Mounting Type
Surface Mount, Right Angle
Contact Shape
Square
Insulation Material
Polyphenylene Sulfide (PPS), Glass Filled
Housing Material
Thermoplastic
Operating Temperature
-40°C~80°C
Packaging
Tape & Reel (TR)
Series
FI
Published
2004
Feature
Solder Retention
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
Connector Type
Receptacle
Number of Positions
21
Number of Rows
2
Voltage - Rated
200V
Fastening Type
Friction Lock
Contact Finish - Mating
Gold
Contact Type
Male Pin
Current Rating (Amps)
1A per Contact
Insulation Height
0.146 3.70mm
Style
Board to Cable/Wire
Number of Positions Loaded
All
Current Rating
1A
Pitch - Mating
0.049 1.25mm
Insulation Color
Black
Row Spacing - Mating
0.055 (1.40mm)
Shrouding
Shrouded - 4 Wall
Contact Finish - Post
Tin or Tin-Alloy
Contact Length - Mating
0.094 2.40mm
Insulation Resistance
100MOhm
Material Flammability Rating
UL94 V-0
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$4.18000
$4.18
500
$4.1382
$2069.1
1000
$4.0964
$4096.4
1500
$4.0546
$6081.9
2000
$4.0128
$8025.6
2500
$3.971
$9927.5
FI-W21P-HFE-E1500 Product Details
FI-W21P-HFE-E1500 Overview
A Receptacle package is included with it.Its mounting type is Surface Mount, Right Angle.Packaging is performed using a Tape & Reel (TR) case.It is part of the FI Series of products.A number of features make it more powerful because of its Solder Retention feature.Surface Mount mounts the part.There is no operating temperature for the device.
FI-W21P-HFE-E1500 Features
FI series
FI-W21P-HFE-E1500 Applications
There are a lot of JAE Electronics FI-W21P-HFE-E1500 Rectangular Connectors applications.