Name	Value
Type	Parameter
Factory Lead Time	6 Weeks
Package / Case	0603
Surface Mount	YES
Terminal Shape	WRAPAROUND
Mounting Feature	SURFACE MOUNT
Dielectric Material	Ceramic
Number of Terminals	2
Mounting Style	Surface Mount
Product Depth (mm)	0.8(mm)
Wire Form	Not Required
Operating Temp Range	-55C to 125C
Case Style	Ceramic Chip
Product Diameter (mm)	Not Required(mm)
Temp Coeff (Dielectric)	C0G
Lead Diameter (nom)	Not Required(mm)
Tolerance (+ or -)	5%
Rad Hardened	No
Microwave Application	NO
Seated Plane Height	Not Required(mm)
Published	2013
Packaging	Tape and Reel
JESD-609 Code	e0
Pbfree Code	no
Number of Terminations	2
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal Finish	Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Capacitance	120pF
Voltage - Rated DC	50V
Packing Method	TR, PAPER, 7 INCH
Technology	STANDARD
Construction	SMT Chip
Reach Compliance Code	not_compliant
Termination Style	PAD
Operating Temperature (Max)	125°C
Operating Temperature (Min)	-55°C
Dielectric	C0G
Failure Rate	Not Required
Temperature Characteristics Code	C0G
Multilayer	Yes
Voltage	50VDC
Positive Tolerance	5%
Negative Tolerance	5%
Product Length (mm)	1.6(mm)
Height	0.8mm
Length	1.6mm
Width	0.8mm
Product Height (mm)	0.8(mm)
RoHS Status	Non-RoHS Compliant
Lead Free	Contains Lead

C0603C121J5GAL7867

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