HX316LS9IB/8

new-10%

Manufacturer part number:HX316LS9IB/8

Manufacturer:Kingston Technology

Description:HX316LS9IB/8 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

Case Package:SOT-23

Datasheet:HX316LS9IB/8 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	EAR99
HTS	8473.30.11.40
Module	DRAM Module
Module Density	8Gbyte
Number of Chip per Module	16
Chip Density (bit)	4G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1600
Chip Configuration	512Mx8
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.28/1.425
Typical Operating Supply Voltage (V)	1.35/1.5
Maximum Operating Supply Voltage (V)	1.45/1.575
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	9
SPD EEPROM Support	No
Standard Package Name	DIMM
Supplier Package	SODIMM
Mounting	Socket
Package Height	30
Package Length	67.6
PCB changed	204
Lead Shape	No Lead
Part Status	Active
Subcategory	DDR3L SDRAM
Pin Count	204
Organization	1Gx64
PLL	No
Self Refresh	No
Module Type	204SODIMM
RoHS Status	Yes with exemptions