KSM26SED8/16ME

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Manufacturer part number:KSM26SED8/16ME

Manufacturer:Kingston Technology

Description:KSM26SED8/16ME datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

Case Package:SOT-23

Datasheet:KSM26SED8/16ME Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	EAR99
HTS	8473.30.11.40
Module	DRAM Module
Module Density	16Gbyte
Number of Chip per Module	18
Chip Density (bit)	8G
Data Bus Width (bit)	72
Maximum Clock Rate (MHz)	2666
Chip Configuration	1Gx8
Chip Package Type	FBGA
Typical Operating Supply Voltage (V)	1.2
Operating Current (mA)	1629
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
ECC Support	Yes
Number of Ranks	Dual
CAS Latency	17
Supplier Package	SODIMM
Mounting	Socket
Package Height	30
Package Length	69.6
Package Width	3.7(Max)
PCB changed	260
Part Status	Obsolete
Pin Count	260
Organization	2Gx72
Module Type	260SODIMM
RoHS Status	RoHS Compliant