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RK73UTH1JTTD1102F

RK73UTH1JTTD1102F

RK73UTH1JTTD1102F

KOASPEERELECTRONICSINC

RK73UTH1JTTD1102F datasheet pdf and Boxes product details from KOASPEERELECTRONICSINC stock available on our website

SOT-23

RK73UTH1JTTD1102F Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 16 Weeks
Mount Chassis
Mounting Type Surface Mount
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 3
Operating Temperature 0°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 3
ECCN Code -
Temperature Coefficient -
Subcategory -
Voltage - Supply 8V ~ 36V
Base Part Number Ucmmmc Mbvyn
Output Voltage 25 V
Output Type Adjustable
Interface -
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current 800 μA
Output Current 40 mA
Max Supply Current -
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4971 items

About RK73UTH1JTTD1102F

The RK73UTH1JTTD1102F from KOASPEERELECTRONICSINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features RK73UTH1JTTD1102F datasheet pdf and Boxes product details from KOASPEERELECTRONICSINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RK73UTH1JTTD1102F, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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