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0077001209

0077001209

0077001209

Laird Technologies EMI

Fingerstock 0.320 8.13mm 24.000 609.60mm 0.110 2.79mm No Snag Beryllium Copper 50.8μm 121°C Nickel

SOT-23

0077001209 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material Beryllium Copper
Operating Temperature 121°C
Series No Snag
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Plating Nickel
Attachment Method Adhesive
Height 0.110 2.79mm
Length 24.000 609.60mm
Width 0.320 8.13mm
Plating Thickness 299.21μin 7.60μm
Thickness 50.8μm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
100 $8.75960 $875.96
0077001209 Product Details

0077001209 Overview


Contact RFI is packaged with materials from Beryllium Copper.The EMI/RFI can work at 121°C.Fingerstock contacter RFI type.RFI EMIs from the well-known No Snag series product line are featured in this RFI EMI.

0077001209 Features


Fingerstock
No Snag series


0077001209 Applications


There are a lot of Laird Technologies EMI
0077001209 RFI and EMI Contacts applications.


  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger
  • LED Lighting

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