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0077008419

0077008419

0077008419

Laird Technologies EMI

Fingerstock 0.370 9.40mm 16.000 406.40mm 0.130 3.30mm No Snag Beryllium Copper 101.6μm 121°C Tin

SOT-23

0077008419 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Material Beryllium Copper
Operating Temperature 121°C
Series No Snag
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Plating Tin
Attachment Method Adhesive
Height 0.130 3.30mm
Length 16.000 406.40mm
Width 0.370 9.40mm
Plating Thickness 299.21μin 7.60μm
Thickness 101.6μm
RoHS Status RoHS Compliant
0077008419 Product Details

0077008419 Overview


The Contact RFI contains materials from Beryllium Copper.The EMI/RFI is capable of working normally at 121°C.Fingerstock RF Type from the contacter RFI.The RFI EMI is a kind of the well-known No Snag series of products.

0077008419 Features


Fingerstock
No Snag series


0077008419 Applications


There are a lot of Laird Technologies EMI
0077008419 RFI and EMI Contacts applications.


  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness

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