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4569PA01H00055

4569PA01H00055

4569PA01H00055

Laird Technologies EMI

Fabric Over Foam 0.197 5.00mm 0.550 13.97mm 0.020 0.50mm I/O Gasket Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) 508μm D-Shape

SOT-23

4569PA01H00055 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
Shape D-Shape
Series I/O Gasket
Published 2013
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fabric Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Adhesive
Height 0.020 0.50mm
Length 0.550 13.97mm
Width 0.197 5.00mm
Thickness 508μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,236 $0.14990 $0.2998
4569PA01H00055 Product Details

4569PA01H00055 Overview


The Contact RFI contains materials from Polyurethane Foam, Nickel-Copper Taffeta (NI/CU).The contacter RFI temperature should not exceed 158°C degrees Celsius.Fabric Over Foam RF Type from the contacter RFI.The RFI EMI is a kind of the well-known I/O Gasket series of products.

4569PA01H00055 Features


Fabric Over Foam
I/O Gasket series


4569PA01H00055 Applications


There are a lot of Laird Technologies EMI
4569PA01H00055 RFI and EMI Contacts applications.


  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness

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