Film Over Foam 0.118 3.00mm 0.197 5.00mm 0.118 3.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 3.048mm Rectangle -40°C~70°C
SOT-23
67SLG030030050PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Rectangle
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.118 3.00mm
Length
0.197 5.00mm
Width
0.118 3.00mm
Thickness
3.048mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
67SLG030030050PI00 Product Details
67SLG030030050PI00 Overview
The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI operates normally at -40°C~70°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.A contacter RFI temperature of 158°C degrees Celsius is recommended.Type Film Over Foam from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.
67SLG030030050PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLG030030050PI00 Applications
There are a lot of Laird Technologies EMI 67SLG030030050PI00 RFI and EMI Contacts applications.