Film Over Foam 0.157 4.00mm 0.118 3.00mm 0.138 3.50mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 3.5052mm Rectangle -40°C~70°C
SOT-23
67SLG040035030PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Rectangle
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.138 3.50mm
Length
0.118 3.00mm
Width
0.157 4.00mm
Thickness
3.5052mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
2,000
$0.11575
$0.2315
6,000
$0.10873
$0.65238
10,000
$0.10172
$1.0172
50,000
$0.08979
$4.4895
100,000
$0.08769
$8.769
67SLG040035030PI00 Product Details
67SLG040035030PI00 Overview
Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are used in Contact RFI packaging.-40°C~70°C is the operating temperature and EMI/RFI works fine.In order to provide high reliability, advanced RFI and EMI contact' packaging Tape & Reel (TR) is used.There should be 158°C more than 158°C degrees Celsius in the contacter RFI.The contacter RFI type is Film Over Foam.A RFI EMI from the well-known SMD Grounding Metallized series of products is being offered here.
67SLG040035030PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLG040035030PI00 Applications
There are a lot of Laird Technologies EMI 67SLG040035030PI00 RFI and EMI Contacts applications.