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67SLG040040025PI00

67SLG040040025PI00

67SLG040040025PI00

Laird Technologies EMI

Film Over Foam 0.157 4.00mm 0.098 2.50mm 0.157 4.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 3.9878mm Rectangle -40°C~70°C

SOT-23

67SLG040040025PI00 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.157 4.00mm
Length 0.098 2.50mm
Width 0.157 4.00mm
Thickness 3.9878mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,800 $0.12880 $0.1288
67SLG040040025PI00 Product Details

67SLG040040025PI00 Overview


Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI can work at -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.

67SLG040040025PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLG040040025PI00 Applications


There are a lot of Laird Technologies EMI
67SLG040040025PI00 RFI and EMI Contacts applications.


  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger
  • LED Lighting

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