Film Over Foam 0.157 4.00mm 0.098 2.50mm 0.157 4.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 3.9878mm Rectangle -40°C~70°C
SOT-23
67SLG040040025PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
3 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Rectangle
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.157 4.00mm
Length
0.098 2.50mm
Width
0.157 4.00mm
Thickness
3.9878mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,800
$0.12880
$0.1288
67SLG040040025PI00 Product Details
67SLG040040025PI00 Overview
Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI can work at -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.
67SLG040040025PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLG040040025PI00 Applications
There are a lot of Laird Technologies EMI 67SLG040040025PI00 RFI and EMI Contacts applications.