Film Over Foam 0.197 5.00mm 0.118 3.00mm 0.197 5.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.0038mm Rectangle -40°C~70°C
SOT-23
67SLG050050030PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Rectangle
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.197 5.00mm
Length
0.118 3.00mm
Width
0.197 5.00mm
Thickness
5.0038mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,500
$0.17595
$0.17595
67SLG050050030PI00 Product Details
67SLG050050030PI00 Overview
There is a Contact RFI that contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).It is possible for the EMI/RFI to operate normally at -40°C~70°C.High reliability can be achieved by using the advanced RFI and EMI contact' packaging Tape & Reel (TR).There should be 158°C temperature above 158°C degrees Celsius when contacter RFI runs.A contacter RFI with the Film Over Foam type.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.
67SLG050050030PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLG050050030PI00 Applications
There are a lot of Laird Technologies EMI 67SLG050050030PI00 RFI and EMI Contacts applications.