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67SLG050050030PI00

67SLG050050030PI00

67SLG050050030PI00

Laird Technologies EMI

Film Over Foam 0.197 5.00mm 0.118 3.00mm 0.197 5.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.0038mm Rectangle -40°C~70°C

SOT-23

67SLG050050030PI00 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.197 5.00mm
Length 0.118 3.00mm
Width 0.197 5.00mm
Thickness 5.0038mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,500 $0.17595 $0.17595
67SLG050050030PI00 Product Details

67SLG050050030PI00 Overview


There is a Contact RFI that contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).It is possible for the EMI/RFI to operate normally at -40°C~70°C.High reliability can be achieved by using the advanced RFI and EMI contact' packaging Tape & Reel (TR).There should be 158°C temperature above 158°C degrees Celsius when contacter RFI runs.A contacter RFI with the Film Over Foam type.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.

67SLG050050030PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLG050050030PI00 Applications


There are a lot of Laird Technologies EMI
67SLG050050030PI00 RFI and EMI Contacts applications.


  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger
  • LED Lighting
  • Utility Energy
  • Smart Energy
  • Thermostats

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