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67SLH050050025PI00

67SLH050050025PI00

67SLH050050025PI00

Laird Technologies EMI

Film Over Foam 0.197 5.00mm 0.098 2.50mm 0.197 5.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.0038mm Hourglass -40°C~70°C

SOT-23

67SLH050050025PI00 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Hourglass
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.197 5.00mm
Length 0.098 2.50mm
Width 0.197 5.00mm
Thickness 5.0038mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,500 $0.13869 $0.13869
67SLH050050025PI00 Product Details

67SLH050050025PI00 Overview


Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).EMI/RFI is able to work normally at the operating temperature of -40°C~70°C.Advanced RFI and EMI contact' packaging Tape & Reel (TR) is used to provide high reliability.Contacter RFI should run at a temperature of 158°C more than 158°C degrees Celsius.Film Over Foam Type from the contacter RFI.It is one of the well-known SMD Grounding Metallized series RFI EMI line.

67SLH050050025PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLH050050025PI00 Applications


There are a lot of Laird Technologies EMI
67SLH050050025PI00 RFI and EMI Contacts applications.


  • Transmit
  • Receive
  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security

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