Film Over Foam 0.197 5.00mm 0.098 2.50mm 0.197 5.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.0038mm Hourglass -40°C~70°C
SOT-23
67SLH050050025PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Hourglass
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.197 5.00mm
Length
0.098 2.50mm
Width
0.197 5.00mm
Thickness
5.0038mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,500
$0.13869
$0.13869
67SLH050050025PI00 Product Details
67SLH050050025PI00 Overview
Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).EMI/RFI is able to work normally at the operating temperature of -40°C~70°C.Advanced RFI and EMI contact' packaging Tape & Reel (TR) is used to provide high reliability.Contacter RFI should run at a temperature of 158°C more than 158°C degrees Celsius.Film Over Foam Type from the contacter RFI.It is one of the well-known SMD Grounding Metallized series RFI EMI line.
67SLH050050025PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLH050050025PI00 Applications
There are a lot of Laird Technologies EMI 67SLH050050025PI00 RFI and EMI Contacts applications.