67SLH050050050PI00

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Manufacturer part number:67SLH050050050PI00

Manufacturer:Laird Technologies EMI

Description:Film Over Foam 0.197 5.00mm 0.197 5.00mm 0.197 5.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 5.0038mm Hourglass -40°C~70°C

Case Package:SOT-23

Datasheet:67SLH050050050PI00 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Hourglass
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Series	SMD Grounding Metallized
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.197 5.00mm
Length	0.197 5.00mm
Width	0.197 5.00mm
Thickness	5.0038mm
RoHS Status	RoHS Compliant

Quantity	Unit Price	Ext. Price
1,000	$0.18768	$0.18768
2,000	$0.17112	$0.34224
5,000	$0.16008	$0.8004
10,000	$0.14904	$1.4904
25,000	$0.14131	$3.53275
50,000	$0.13800	$6.9

67SLH050050050PI00 Overview

There is a Contact RFI that contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).It is possible for the EMI/RFI to operate normally at -40°C~70°C.High reliability can be achieved by using the advanced RFI and EMI contact' packaging Tape & Reel (TR).There should be 158°C temperature above 158°C degrees Celsius when contacter RFI runs.A contacter RFI with the Film Over Foam type.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.