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BMI-C-007-01

BMI-C-007-01

BMI-C-007-01

Laird Technologies EMI

Shield Finger 0.059 1.50mm 0.130 3.30mm 0.126 3.20mm BMI-C Beryllium Copper Tin

SOT-23

BMI-C-007-01 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 5 Weeks
Material Beryllium Copper
Packaging Tape & Reel (TR)
Series BMI-C
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Shield Finger
Plating Tin
Attachment Method Solder
Height 0.126 3.20mm
Length 0.130 3.30mm
Width 0.059 1.50mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,300 $0.26847 $0.53694
6,900 $0.24995 $1.4997
11,500 $0.24069 $2.64759
BMI-C-007-01 Product Details

BMI-C-007-01 Overview


The Contact RFI is packaged with the materials of Beryllium Copper.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.Type Shield Finger from the contacter RFI.As you may know, this RFI EMI comes from the well-known BMI-C series product line.

BMI-C-007-01 Features


Shield Finger
Tape & Reel (TR) is used
BMI-C series


BMI-C-007-01 Applications


There are a lot of Laird Technologies EMI
BMI-C-007-01 RFI and EMI Contacts applications.


  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger

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