LAXP2-17E-5QN208E Overview

In the package 208-BFQFP, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 146 I/Os for transferring data in a more coherent manner. Logic blocks consist of 17000 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. The Field Programmable Gate Arrays family of FPGAs includes this part. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 1.14V~1.26V . This is a type of FPGA that is part of the LA-XP2 series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~125°C TJ. In order to make this device as versatile as possible, there are 146 different outputs included. A model of this FPGA is contained in Tray for the purpose of saving space. As a whole, it has 208 terminations. Having a RAM bit size of 282624 means that this device will offer you a lot of memory. You can find related parts by using the part number LAXP2, which is its base part number. For the program to work properly, the RAM si34.5kBe of this FPGA module must reach 34.5kB GB in order to ensure normal operation. The device is designed with 208 pins in total. Fpga electronics contains 2125 LABs/CLBs in an array. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. It is powered by a 1.21.2/3.33.3V battery, which can be purchased separately. As far as the pin count is concerned, it has 208 pins. It usually uses a 435MHz crystal. In this FPGA module, there is a memory of 38.9kB available for storing applications and data.

LAXP2-17E-5QN208E Features

146 I/Os
Up to 282624 RAM bits
208 LABs/CLBs

LAXP2-17E-5QN208E Applications

There are a lot of Lattice Semiconductor Corporation LAXP2-17E-5QN208E FPGAs applications.

• Industrial IoT
• Wired Communications
• ASIC prototyping
• Medical imaging
• Digital signal processing
• Industrial Ethernet
• Artificial intelligence (AI)
• Ecosystem
• Military Temperature
• Solar Energy