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LC5512MV-75F256C

LC5512MV-75F256C

LC5512MV-75F256C

Lattice Semiconductor Corporation

1mm PMIC ispXPLD? 5000MV Series LC5512 256 Pin 200MHz 3.3V 256-BGA

SOT-23

LC5512MV-75F256C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature 0°C~90°C TJ
Packaging Tray
Published 2000
Series ispXPLD® 5000MV
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 3.3V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LC5512
Pin Count 256
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Programmable Type In System Programmable
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Operating Supply Current 33mA
Number of I/O 193
Nominal Supply Current 33mA
RAM Size 32kB
Memory Type EEPROM, SRAM
Propagation Delay 7.5 ns
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 3V~3.6V
Number of Logic Elements/Blocks 16
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant
Lead Free Lead Free
LC5512MV-75F256C Product Details

LC5512MV-75F256C Overview


A mobile phone network consists of 512macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).It is part of the 256-BGA package.It is programmed with 193 I/Os.It is programmed that device terminations will be 256 .There is a BOTTOMterminal position on the electrical part in question.A voltage of 3.3V is used as the power supply for this device.This part is part of the family [0].It is recommended that the chip be packaged by Tray.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].It is recommended to mount the chip by Surface Mount.FPGAs belonging to the ispXPLD? 5000MVseries contain this type of chip.It is equipped with 256 pin count.This device can also display [0].There are related parts in [0].Optimal efficiency requires a supply voltage of [0].It is recommended to store data in [0].This device is mounted by Surface Mount.There are 256 pins on the device.In this case, the maximum supply voltage is 3.6V.A minimum supply voltage of 3V is required for it to operate.There are 16 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.This frequency can be achieved at 200MHz.

LC5512MV-75F256C Features


256-BGA package
193 I/Os
The operating temperature of 0°C~90°C TJ
256 pin count
256 pins

LC5512MV-75F256C Applications


There are a lot of Lattice Semiconductor Corporation LC5512MV-75F256C CPLDs applications.

  • PLC analog input modules
  • Dedicated input registers
  • Digital multiplexers
  • Protection relays
  • White goods (Washing, Cold, Aircon ,...)
  • Code converters
  • USB Bus
  • Reset swapping
  • LED Lighting systems
  • Multiple DIP Switch Replacement

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