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LCMXO2-1200UHC-4FTG256C

LCMXO2-1200UHC-4FTG256C

LCMXO2-1200UHC-4FTG256C

Lattice Semiconductor Corporation

2.5V V 20.5kB B FPGAs MachXO2 Series 269MHz MHz 256-LBGA 56μA mA 1mm mm 256

SOT-23

LCMXO2-1200UHC-4FTG256C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2012
Series MachXO2
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.375V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 269MHz
[email protected] Reflow Temperature-Max (s) 30
Base Part Number LCMXO2-1200
Pin Count 256
Number of Outputs 207
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Power Supplies 2.5/3.3V
Memory Size 20.5kB
Operating Supply Current 56μA
Number of I/O 206
RAM Size 9.3kB
Memory Type FLASH
Propagation Delay 7.24 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1280
Total RAM Bits 75776
Number of LABs/CLBs 160
Number of Macro Cells 640
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $11.21000 $11.21
25 $10.74040 $268.51
LCMXO2-1200UHC-4FTG256C Product Details

LCMXO2-1200UHC-4FTG256C Overview


Fpga chips is supplied in the 256-LBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 206 I/Os for transferring data in a more coherent manner. A fundamental building block contains 1280 logic elements or cells. It is powered from a supply voltage of 2.5V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 2.375V~3.465V-volt supply voltage required for the device to operate. An FPGA belonging to the MachXO2 series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. A device such as this one has 207 outputs built into it. In order to save space, this FPGA model has been contained in Tray. 256 terminations are present in total. The RAM bits that are offered by this fpga chips are 75776. Its base part number LCMXO2-1200 can be used to find related parts. During the configuration of this FPGA module, the RAM si9.3kBe reaches 9.3kB to ensure that the program runs normally. 256 pins are designed into the device. 160 LABs and CLBs are built into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. In operation with 2.5V, designers can take advantage of its flexibility to the fullest extent. It is powered by a 2.5/3.3V battery, which can be purchased separately. As far as the pin count is concerned, it has 256 pins. A memory of 20.5kB is embedded in this FPGA module for storing data and programs. This device operates at a frequency of 269MHz in order to provide high efficiency. It operates at 56μA amps of supply current. In this device, the main building blocks of a CPLD are 640 macro cells, which serve as the main components of the device. This memory is designed for storing data and avoiding resource conflicts.

LCMXO2-1200UHC-4FTG256C Features


206 I/Os
Up to 75776 RAM bits
256 LABs/CLBs
Operating from a frequency of 269MHz

LCMXO2-1200UHC-4FTG256C Applications


There are a lot of Lattice Semiconductor Corporation LCMXO2-1200UHC-4FTG256C FPGAs applications.

  • Server Applications
  • High Performance Computing
  • Military DSP
  • Voice recognition
  • Medical Electronics
  • Solar Energy
  • Data center hardware accelerators
  • Space Applications
  • Wired Communications
  • Integrating multiple SPLDs

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