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LCMXO2-640HC-4SG48C

LCMXO2-640HC-4SG48C

LCMXO2-640HC-4SG48C

Lattice Semiconductor Corporation

FPGAs MachXO2 Series 48-VFQFN Exposed Pad

SOT-23

LCMXO2-640HC-4SG48C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2013
Series MachXO2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
HTS Code 8542.39.00.01
Voltage - Supply 2.375V~3.465V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 40
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 640
Total RAM Bits 18432
Number of LABs/CLBs 80
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.89000 $3.89
25 $3.78160 $94.54
LCMXO2-640HC-4SG48C Product Details

LCMXO2-640HC-4SG48C Overview


There are two packages that contain fpga chips: 48-VFQFN Exposed Pad package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 40 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 640 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. With a supply voltage of 2.375V~3.465V, this device operates with ease. The MachXO2 Series is one of the types of FPGAs that belong to this type. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. Fpga electronics is worth mentioning that this device provides 18432 bfpga electronics s of RAM. This FPGA is built as an array of 80 LABs/CLBs.

LCMXO2-640HC-4SG48C Features


40 I/Os
Up to 18432 RAM bits

LCMXO2-640HC-4SG48C Applications


There are a lot of Lattice Semiconductor Corporation LCMXO2-640HC-4SG48C FPGAs applications.

  • ADAS
  • Solar Energy
  • Data center hardware accelerators
  • Automotive advanced driver assistance systems (ADAS)
  • Wireless Communications
  • Military Temperature
  • Consumer Electronics
  • Data Center
  • Broadcast
  • Industrial IoT

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