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LCMXO2-640HC-4SG48I

LCMXO2-640HC-4SG48I

LCMXO2-640HC-4SG48I

Lattice Semiconductor Corporation

FPGAs MachXO2 Series 48-VFQFN Exposed Pad

SOT-23

LCMXO2-640HC-4SG48I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series MachXO2
Part Status Active
Moisture Sensitivity Level (MSL) 3
ECCN Code EAR99
HTS Code 8542.39.00.01
Voltage - Supply 2.375V~3.465V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 40
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 640
Total RAM Bits 18432
Number of LABs/CLBs 80
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
260 $4.22785 $1099.241
LCMXO2-640HC-4SG48I Product Details

LCMXO2-640HC-4SG48I Overview


As part of the 48-VFQFN Exposed Pad package, it is included. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. A total of 40 I/Os are programmed to ensure a more coherent data transfer. There are 640 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~3.465V. It is a type of FPGA belonging to the MachXO2 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 18432 bFpga chipss. 80 LABs/CLBs are configured on this FPGA.

LCMXO2-640HC-4SG48I Features


40 I/Os
Up to 18432 RAM bits

LCMXO2-640HC-4SG48I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO2-640HC-4SG48I FPGAs applications.

  • Electronic Warfare
  • Ecosystem
  • Industrial IoT
  • Consumer Electronics
  • Embedded Vision
  • Medical ultrasounds
  • Data center hardware accelerators
  • Voice recognition
  • Wired Communications
  • Solar Energy

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