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LCMXO3D-4300ZC-3BG256I

LCMXO3D-4300ZC-3BG256I

LCMXO3D-4300ZC-3BG256I

Lattice Semiconductor Corporation

FPGAs MachXO3D Series 256-LFBGA

SOT-23

LCMXO3D-4300ZC-3BG256I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LFBGA
Operating Temperature -40°C~100°C TJ
Series MachXO3D
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~3.465V
Reach Compliance Code compliant
Number of I/O 206
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4300
Total RAM Bits 94208
Number of LABs/CLBs 538
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $24.31000 $24.31
500 $24.0669 $12033.45
1000 $23.8238 $23823.8
1500 $23.5807 $35371.05
2000 $23.3376 $46675.2
2500 $23.0945 $57736.25
LCMXO3D-4300ZC-3BG256I Product Details

LCMXO3D-4300ZC-3BG256I Overview


There is a 256-LFBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 206 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 4300 logic elements/cells are required. This FPGA module can be attached to the development board with a Surface Mount. The supply voltage of the device is 2.375V~3.465V , at which it runs. There are many types of FPGAs in the MachXO3D series, this is one of them. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Having a RAM bit size of 94208 means that this device will offer you a lot of memory. 538 LABs/CLBs are integrated into this FPGA.

LCMXO3D-4300ZC-3BG256I Features


206 I/Os
Up to 94208 RAM bits

LCMXO3D-4300ZC-3BG256I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO3D-4300ZC-3BG256I FPGAs applications.

  • Server Applications
  • Video & Image Processing
  • High Performance Computing
  • Development Boards and Shields for Microcontrollers
  • Voice recognition
  • Software-defined radios
  • Military DSP
  • Secure Communication
  • ASIC prototyping
  • Audio

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