LCMXO3LF-4300E-6MG121I

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Manufacturer part number:LCMXO3LF-4300E-6MG121I

Manufacturer:Lattice Semiconductor Corporation

Description:1mm mm FPGAs MachXO3 Series 121-VFBGA 0.5mm mm 121

Case Package:SOT-23

Datasheet:LCMXO3LF-4300E-6MG121I Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	121-VFBGA
Number of Pins	121
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2015
Series	MachXO3
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	121
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Voltage - Supply	1.14V~1.26V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	0.5mm
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	100
RAM Size	11.5kB
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	4320
Total RAM Bits	94208
Number of LABs/CLBs	540
Number of CLBs	540
Height Seated (Max)	1mm
Length	6mm
Width	6mm
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
490	$8.04869	$3943.8581

LCMXO3LF-4300E-6MG121I Description

The LCMXO3LF-4300E-6MG121I is an Ultra-Low Density family that supports the most advanced programmable bridging and I/O expansion. It has the breakthrough I/O density and the lowest cost per I/O.

LCMXO3LF-4300E-6MG121I Features

Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
Optimized footprint, logic density, I/O count, I/O performance devices for I/O management and logic applications
High I/O logic, lowest cost I/O, high I/O devices for I/O expansion applications
Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
Optimized footprint, logic density, I/O count, I/O performance devices for I/O management and logic applications
High I/O logic, lowest cost I/O, high I/O devices for I/O expansion applications