LFE2-12E-6Q208I Overview

There are two packages that contain fpga chips: 208-BFQFP package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 12000 logic elements/cells. It is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. There are many types of FPGAs in the ECP2 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. This device is equipped with 131 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. In total, there are a total of 208 terminations on fpga chips. As far as the RAM bits are concerned, this device offers you a total of 226304. For related parts, use its base part number LFE2-12. Fpga electronics is important that this FPGA module has a RAM si27.6kBe of 27.6kB in order to ensure that the program will run normally. In this case, there are 208 pins on the board. Fpga electronics contains 1500 LABs/CLBs in an array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. There are a total of 208 pins on this device. Programs and data can be stored in the 30.6kB memory embedded in this FPGA module. Using this FPGA, you can get speeds up to 357MHz.

LFE2-12E-6Q208I Features

131 I/Os
Up to 226304 RAM bits
208 LABs/CLBs

LFE2-12E-6Q208I Applications

There are a lot of Lattice Semiconductor Corporation LFE2-12E-6Q208I FPGAs applications.

• Device controllers
• Image processing
• Integrating multiple SPLDs
• Ecosystem
• Industrial IoT
• High Performance Computing
• Aerospace and Defense
• Electronic Warfare
• Voice recognition
• Security systems