1.2V V 2.6mm mm 146kB B FPGAs ECP2 Series 900-BBGA 1mm mm 900
SOT-23
LFE2-70E-6FN900I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA
Number of Pins
900
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2008
Series
ECP2
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
900
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
LFE2-70
Pin Count
900
Number of Outputs
583
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Memory Size
146kB
Number of I/O
583
RAM Size
129kB
Clock Frequency
357MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
68000
Total RAM Bits
1056768
Number of LABs/CLBs
8500
Combinatorial Delay of a CLB-Max
0.331 ns
Number of Logic Cells
70000
Height Seated (Max)
2.6mm
Length
31mm
Width
31mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
27
$200.99148
$5426.76996
LFE2-70E-6FN900I Product Details
LFE2-70E-6FN900I Overview
A 900-BBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 68000 logic elements/cells. Power is provided by a 1.2V-volt supply. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.14V~1.26V , at which it runs. This is a type of FPGA that is part of the ECP2 series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. In this device, there are 583 outputs that can be used. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. 900 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1056768 bFpga chipss. In order to find related parts, you can use its base part number LFE2-70. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device is designed with 900 pins in total. The FPGA consists of 8500 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There are a total of 900 pins on this device. Fpga semiconductor typically uses a crystal oscillating at 357MHz. Data and programs can be stored in this FPGA module's 146kB memory. For the building block, it incorporates 70000 logic cells that are used to make it work.
LFE2-70E-6FN900I Features
583 I/Os Up to 1056768 RAM bits 900 LABs/CLBs
LFE2-70E-6FN900I Applications
There are a lot of Lattice Semiconductor Corporation LFE2-70E-6FN900I FPGAs applications.
Integrating multiple SPLDs
Secure Communication
Random logic
Space Applications
Solar Energy
Cryptography
Automotive Applications
Industrial,Medical and Scientific Instruments
Video & Image Processing
Development Boards and Shields for Microcontrollers