LFE2-70SE-6FN900I Overview

A 900-BBGA package contains it, and it is available for download. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block is made up of 68000 logic elements/cells. An electrical supply voltage of 1.2V powers it. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . It is a type of FPGA that belongs to the ECP2 series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. In this device, 583 outputs are incorporated in order to provide you with maximum flexibility. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is designed wFpga chipsh 900 terminations. This device is equipped with 1056768 RAM bits in terms of its RAM si1056768e. In order to find related parts, you can use its base part number LFE2-70. This FPGA module has a RAM si129kBe of 129kB that is sufficient to make sure that the program is able to run normally. In this case, there are 900 pins on the board. An array of 8500 LABs/CLBs is built into the FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Featuring 900 pins in total, it is a versatile device. Data and programs can be stored in this FPGA module's 146kB memory. As fast as 357MHz can be reached with this FPGA. During the construction of the building block, there are 70000 logic cells used.

LFE2-70SE-6FN900I Features

583 I/Os
Up to 1056768 RAM bits
900 LABs/CLBs

LFE2-70SE-6FN900I Applications

There are a lot of Lattice Semiconductor Corporation LFE2-70SE-6FN900I FPGAs applications.

• Server Applications
• Video & Image Processing
• Embedded Vision
• Enterprise networking
• Camera time adjustments
• ASIC prototyping
• Device controllers
• Distributed Monetary Systems
• Ecosystem
• Artificial intelligence (AI)