1.2V V 2.6mm mm 584.9kB B FPGAs ECP2M Series 900-BBGA 1mm mm 900
SOT-23
LFE2M70E-7FN900C Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA
Number of Pins
900
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2012
Series
ECP2M
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
900
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
LFE2M70
Pin Count
900
Number of Outputs
416
Operating Supply Voltage
1.2V
Memory Size
584.9kB
Number of I/O
416
RAM Size
566.8kB
Clock Frequency
420MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
67000
Total RAM Bits
4642816
Number of LABs/CLBs
8375
Combinatorial Delay of a CLB-Max
0.304 ns
Number of Logic Cells
70000
Height Seated (Max)
2.6mm
Length
31mm
Width
31mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
27
$278.76185
$7526.56995
LFE2M70E-7FN900C Product Details
LFE2M70E-7FN900C Overview
There are two packages that contain fpga chips: 900-BBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 416 I/Os for transferring data in a more coherent manner. A fundamental building block is made up of 67000 logic elements/cells. It is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. An FPGA belonging to the ECP2M series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 416 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, it has a total of 900 terminations. This device has 4642816 RAM bits, which is the number of RAM bits that this device offers. You can find related parts by using the part number LFE2M70, which is its base part number. The FPGA module's RAM si566.8kBe reaches 566.8kB in order to ensure that the program operates in a normal manner. The device has 900 pins which are included in the design. 8375 LABs and CLBs are built into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A 1.2V-volt supply allows designers to fully utilize its flexibility. As far as the pin count is concerned, it has 900 pins. A crystal oscillating at 420MHz is one of the most common components of this device. In this FPGA module, there is a memory of 584.9kB available for storing applications and data. During the construction of the building block, there are 70000 logic cells used.
LFE2M70E-7FN900C Features
416 I/Os Up to 4642816 RAM bits 900 LABs/CLBs
LFE2M70E-7FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M70E-7FN900C FPGAs applications.
DO-254
High Performance Computing
Industrial,Medical and Scientific Instruments
Development Boards and Shields for Microcontrollers