LFE2M70SE-5F1152I Overview

There is a 1152-BBGA package that includes this component. A total of 436 I/Os are programmed to ensure a more coherent data transfer. Logic blocks consist of 67000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. As part of the ECP2M series of FPGAs, it is a type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 4642816. Related parts can be found by using its base part number LFE2M70. This FPGA module has a RAM si566.8kBe of 566.8kB that is sufficient to make sure that the program is able to run normally. Fpga electronics is designed wfpga electronics h 1152 pins. This FPGA is built as an array of 8375 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Designers can fully utilize its flexibility with 1.2V supply voltage. There is a maximum operating temperature of 100°C for this module. Operating temperatures should exceed -40°C. Its basic building block is composed of 8375 logic blocks (LABs). Data and programs can be stored in this FPGA module's memory of 584.9kB. Device package 1152-FPBGA (35x35) is provided by its supplier.

LFE2M70SE-5F1152I Features

436 I/Os
Up to 4642816 RAM bits
1152 LABs/CLBs
100°C gates
8375 logic blocks (LABs)

LFE2M70SE-5F1152I Applications

There are a lot of Lattice Semiconductor Corporation LFE2M70SE-5F1152I FPGAs applications.

• Audio
• Industrial Ethernet
• Automation
• Wired Communications
• Ecosystem
• Military DSP
• Device controllers
• Industrial,Medical and Scientific Instruments
• ASIC prototyping
• Electronic Warfare