LFE2M70SE-7FN900C Overview

This package is included in the 900-BBGA package and is available for purchase. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 416 I/Os are available for transferring data more efficiently. A fundamental building block consists of 67000 logic elements/cells. Power is provided by a 1.2V-volt supply. The Field Programmable Gate Arrays family of FPGAs includes this part. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 1.14V~1.26V, this device operates with ease. FPGAs belonging to the ECP2M series are a type of FPGA that belong to the ECP2M series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. During the installation of this device, 416 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The total number of terminations is 900. The RAM bits that this device offer is 4642816. In order to find related parts, use the part number LFE2M70 as a base. Fpga electronics is important that this FPGA module has a RAM si566.8kBe of 566.8kB in order to ensure that the program will run normally. There are 900 pins on this device. 8375 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. The 1.2V supply voltage provides designers with full flexibility in their designs. The device has a total of 900 pins on fpga semiconductor. Usually, fpga semiconductor uses a 420MHz crystal. In this FPGA module, there is a memory of 584.9kB that can be used to store programs and data. It incorporates 70000 logic cells used for the building block.

LFE2M70SE-7FN900C Features

416 I/Os
Up to 4642816 RAM bits
900 LABs/CLBs

LFE2M70SE-7FN900C Applications

There are a lot of Lattice Semiconductor Corporation LFE2M70SE-7FN900C FPGAs applications.

• Medical Electronics
• Data center hardware accelerators
• Development Boards and Shields for Microcontrollers
• Bioinformatics
• Data Center
• Secure Communication
• Wired Communications
• Enterprise networking
• Distributed Monetary Systems
• Image processing