LFE3-17EA-6LFTN256I Overview

There are two packages that contain fpga chips: 256-BGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Having 133 I/Os makes data transfers more coherent. A fundamental building block is made up of 17000 logic elements/cells. Power is provided by a 1.2V-volt supply. The Field Programmable Gate Arrays family of FPGA parts includes this part. An attachment Surface Mount allows the FPGA module to be attached to the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. There are many types of FPGAs in the ECP3 series, this is one of them. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. A device such as this one has 133 outputs built into it. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, there are a total of 256 terminations on fpga chips. This device has 716800 RAM bits, which is the number of RAM bits that this device offers. If you are looking for related parts, you can use the base part number LFE3-17 as a starting point. It is crucial that the RAM si87.5kBe of this FPGA module reaches 87.5kB so that the program can run normally. It has a total of 256 pins that are designed for it. 2125 LABs/CLBs are configured on this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. With a total of 256 pins, it is equipped with a high level of security. Most commonly, this device makes use of an oscillating crystal frequency of 375MHz to operate.

LFE3-17EA-6LFTN256I Features

133 I/Os
Up to 716800 RAM bits
256 LABs/CLBs

LFE3-17EA-6LFTN256I Applications

There are a lot of Lattice Semiconductor Corporation LFE3-17EA-6LFTN256I FPGAs applications.

• Software-defined radio
• Scientific Instruments
• Digital signal processing
• Automotive advanced driver assistance systems (ADAS)
• Embedded Vision
• Automotive
• ASIC prototyping
• Secure Communication
• Development Boards and Shields for Microcontrollers
• Data Center