This package is included in the 328-LFBGA, CSBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 17000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the ECP3 series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 716800. There is a maximum RAM si87.5kBe of 87.5kB on this FPGA module, which is necessary to ensure the normal operation of the program. An array of 2125 LABs/CLBs is built into the FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. A maximum operating temperature of 85°C can be reached by this module. Over 0°C should be the operating temperature. A basic building block of this system consists of 2125 logic blocks (LABs). There is a device package provided by 328-CSBGA (10x10), which is the supplier.
LFE3-17EA-7MG328CAHQ Features
116 I/Os Up to 716800 RAM bits 85°C gates 2125 logic blocks (LABs)
LFE3-17EA-7MG328CAHQ Applications
There are a lot of Lattice Semiconductor Corporation LFE3-17EA-7MG328CAHQ FPGAs applications.