LFE3-35EA-7FN672C Overview

In the package 672-BBGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 310 I/Os help it transfer data more efficiently. There are 33000 logic elements/cells to form a fundamental building block. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. This FPGA part belongs to the family of Field Programmable Gate Arrays. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. An FPGA belonging to the ECP3 series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In this device, there are 310 outputs that can be used. It is for space saving reasons that this FPGA model is contained in Tray. In total, the terminations of this piece are 672. This device is equipped with 1358848 RAM bits in terms of its RAM si1358848e. Its base part number LFE3-35 can be used to find related parts. There is a maximum RAM si165.9kBe of 165.9kB on this FPGA module, which is necessary to ensure the normal operation of the program. In this case, there are 672 pins on the board. Fpga electronics contains 4125 LABs/CLBs in an array. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. The device has a total of 672 pins on fpga semiconductor. In this FPGA module, there is a memory of 174.4kB that can be used to store programs and data. A FPGA of this type can achieve a speed as high as 420MHz. It operates at 18mA amps of supply current.

LFE3-35EA-7FN672C Features

310 I/Os
Up to 1358848 RAM bits
672 LABs/CLBs

LFE3-35EA-7FN672C Applications

There are a lot of Lattice Semiconductor Corporation LFE3-35EA-7FN672C FPGAs applications.

• ASIC prototyping
• Filtering and communication encoding
• Distributed Monetary Systems
• Integrating multiple SPLDs
• Radar and Sensors
• Military Temperature
• ADAS
• Random logic
• Artificial intelligence (AI)
• Digital signal processing