LFE3-70E-6FN484C Overview

A 484-BBGA package contains it, and it is available for download. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. This device features 295 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 67000 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. The Field Programmable Gate Arrays family of FPGAs includes this part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. There are many types of FPGAs in the ECP3 series, this is one of them. The operating temperature should be kept at 0°C~85°C TJ when operating. In this device, there are 295 outputs that can be used. This FPGA model is contained in Tray for space saving. The total number of terminations is 484. As far as the RAM bits are concerned, this device offers you a total of 4526080. In order to find related parts, you can use its base part number LFE3-70. For the program to work properly, the RAM si552.5kBe of this FPGA module must reach 552.5kB GB in order to ensure normal operation. This cable has 484 pins and is designed to connect to a computer. The FPGA consists of 8375 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Fpga semiconductor is equipped wfpga semiconductorh 484 pin count. Fpga semiconductor typically uses a crystal oscillating at 375MHz. In this FPGA module, there is a memory of 570.6kB available for storing applications and data.

LFE3-70E-6FN484C Features

295 I/Os
Up to 4526080 RAM bits
484 LABs/CLBs

LFE3-70E-6FN484C Applications

There are a lot of Lattice Semiconductor Corporation LFE3-70E-6FN484C FPGAs applications.

• Computer hardware emulation
• Broadcast
• Radar and Sensors
• Digital signal processing
• Ecosystem
• Random logic
• ASIC prototyping
• Solar Energy
• Wireless Communications
• Enterprise networking