There are two packages that contain fpga chips: 554-FBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The device has 245 I/O ports for more coherent data transfer. A fundamental building block is made up of 44000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates at a voltage of 1.045V~1.155V and uses a battery to supply power. The ECP5 Series is one of the types of FPGAs that belong to this type. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 1990656 means that this device will offer you a lot of memory. The FPGA module's RAM si243kBe reaches 243kB in order to ensure that the program operates in a normal manner. The FPGA consists of 11000 LABs/CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications.
LFE5UM-45F-8BG554I Features
245 I/Os Up to 1990656 RAM bits
LFE5UM-45F-8BG554I Applications
There are a lot of Lattice Semiconductor Corporation LFE5UM-45F-8BG554I FPGAs applications.
Device controllers
Artificial intelligence (AI)
Military DSP
Data Mining
Automotive advanced driver assistance systems (ADAS)