A 756-FBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 365 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 84000 logic elements/cells are required. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.045V~1.155V battery. An FPGA belonging to the ECP5 series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. This device has 3833856 RAM bits, which is the number of RAM bits that this device offers. The RAM si468kBe of this FPGA module reaches 468kB so as to guarantee the normal operation of the program during operation. 21000 LABs/CLBs are integrated into this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount.
LFE5UM-85F-7BG756I Features
365 I/Os Up to 3833856 RAM bits
LFE5UM-85F-7BG756I Applications
There are a lot of Lattice Semiconductor Corporation LFE5UM-85F-7BG756I FPGAs applications.
Digital signal processing
Automotive advanced driver assistance systems (ADAS)
Military DSP
Telecommunication
Aircraft navigation
Space Applications
Medical imaging
Bioinformatics
Secure Communication
Development Boards and Shields for Microcontrollers