LFE5UM-85F-8BG554I Overview

There are two packages that contain fpga chips: 554-FBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. There are 259 I/Os for better data transfer. In order to construct a fundamental building block, 84000 logic elements/cells are required. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Powered by a 1.045V~1.155V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the ECP5 series is referred to as an FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga electronics is worth mentioning that this device provides 3833856 bfpga electronics s of RAM. It is crucial that the RAM si468kBe of this FPGA module reaches 468kB so that the program can run normally. The FPGA is built as an array of 21000 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount.

LFE5UM-85F-8BG554I Features

259 I/Os
Up to 3833856 RAM bits

LFE5UM-85F-8BG554I Applications

There are a lot of Lattice Semiconductor Corporation LFE5UM-85F-8BG554I FPGAs applications.

• Enterprise networking
• Audio
• Military Temperature
• Wireless Communications
• Software-defined radios
• Image processing
• Consumer Electronics
• ASIC prototyping
• Military DSP
• Data center hardware accelerators