In the package 756-FBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Fpga chips is programmed wFpga chipsh 365 I/Os for transferring data in a more coherent manner. Logic blocks consist of 84000 logic elements/cells. The supply voltage is 1.1V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order to operate it, it requires a voltage supply of 1.045V~1.155V . The FPGA belongs to the ECP5 series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. As a space-saving measure, this FPGA model is contained within Tray. The total number of terminations is 756. There are 3833856 RAM bits that are available with this device. The RAM si468kBe of this FPGA module reaches 468kB so as to guarantee the normal operation of the program during operation. The FPGA consists of 21000 LABs/CLBs. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. A CLB is a basic module that determines the architecture of a system.
LFE5UM-85F-8BG756C Features
365 I/Os Up to 3833856 RAM bits
LFE5UM-85F-8BG756C Applications
There are a lot of Lattice Semiconductor Corporation LFE5UM-85F-8BG756C FPGAs applications.
Video & Image Processing
Integrating multiple SPLDs
Distributed Monetary Systems
Medical Applications
Automotive advanced driver assistance systems (ADAS)