LFSC3GA25E-6FF1020I Overview

There are two packages that contain fpga chips: 1020-BBGA, FCBGA package and X package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. The device has 476 I/O ports for more coherent data transfer. A fundamental building block is made up of 25000 logic elements/cells. An electrical supply voltage of 1.2V powers it. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 0.95V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the SC series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~105°C TJ when operating. A device such as this one has 476 outputs built into it. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1966080 bFpga chipss. Its base part number LFSC3GA25 can be used to find parts that are related to it. During the configuration of this FPGA module, the RAM si240kBe reaches 240kB to ensure that the program runs normally. Fpga electronics is designed wfpga electronics h 1020 pins. A total of 6250 LABs/CLBs are included in this FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. Fpga electronics operates from a 1.21.2/3.32.5V power supply. There are 104 CLBs that make up the architecture of the system. This FPGA can get as fast as 700MHz. As part of the building blocks, it consists of 25400 logic cells.

LFSC3GA25E-6FF1020I Features

476 I/Os
Up to 1966080 RAM bits
1020 LABs/CLBs

LFSC3GA25E-6FF1020I Applications

There are a lot of Lattice Semiconductor Corporation LFSC3GA25E-6FF1020I FPGAs applications.

• Development Boards and Shields for Microcontrollers
• Bioinformatics
• Integrating multiple SPLDs
• Data Mining
• Consumer Electronics
• Telecommunication
• ASIC prototyping
• Security systems
• Solar Energy
• Industrial IoT