LFSCM3GA80EP1-5FFN1152I Overview

There are two packages that contain fpga chips: 1152-BBGA package and X package. Its 660 I/Os help it transfer data more efficiently. A fundamental building block consists of 80000 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.95V~1.26V . As part of the SCM series of FPGAs, it is a type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~105°C TJ when operating the machine. There is an FPGA model contained in Tray in order to conserve space. There are 5816320 RAM bits that are available with this device. Parts related to this part can be found using its base part number LFSCM3GA80. The RAM si710kBe of this FPGA module reaches 710kB to ensure normal operation of the program. In this case, 1152 pins are used in the design. Fpga electronics contains 20000 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications.

LFSCM3GA80EP1-5FFN1152I Features

660 I/Os
Up to 5816320 RAM bits
1152 LABs/CLBs

LFSCM3GA80EP1-5FFN1152I Applications

There are a lot of Lattice Semiconductor Corporation LFSCM3GA80EP1-5FFN1152I FPGAs applications.

• Automotive Applications
• Military Temperature
• Telecommunication
• Solar Energy
• Consumer Electronics
• Video & Image Processing
• Server Applications
• Military DSP
• Filtering and communication encoding
• Distributed Monetary Systems