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LFX200EB-03FN256I

LFX200EB-03FN256I

LFX200EB-03FN256I

Lattice Semiconductor Corporation

2.5V V 2.1mm mm 19.3kB B FPGAs ispXPGA? Series 256-BGA 1mm mm 256

SOT-23

LFX200EB-03FN256I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2000
Series ispXPGA®
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature ALSO OPERATES WITH 3.3V SUPPLY
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.3V~3.6V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 2.5V
Terminal Pitch 1mm
Base Part Number LFX200
Pin Count 256
Number of Outputs 160
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Power Supplies 2.5/3.3V
Memory Size 19.3kB
Number of I/O 160
RAM Size 13.9kB
Clock Frequency 320MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2704
Total RAM Bits 113664
Number of Gates 210000
Combinatorial Delay of a CLB-Max 1.07 ns
Number of CLBs 676
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
LFX200EB-03FN256I Product Details

LFX200EB-03FN256I Overview


There are two packages that contain fpga chips: 256-BGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Having 160 I/Os makes data transfers more coherent. There are 2704 logic elements/cells to form a fundamental building block. Power is provided by a 2.5V-volt supply. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 2.3V~3.6V is needed in order for fpga chips to operate. This is a type of FPGA that is part of the ispXPGA? series of FPGAs. The operating temperature should be kept at -40°C~105°C TJ when operating. There are 160 outputs incorporated in this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that this device offer is 113664. Its base part number LFX200 can be used to find related parts. The RAM si13.9kBe of this FPGA module reaches 13.9kB so as to guarantee the normal operation of the program during operation. In this case, there are 256 pins on the board. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Its flexibility is fully utilized when operated with a supply voltage of 2.5V. An external power supply of 2.5/3.3V is required to power the device. Fpga semiconductor is made up of 210000 gates as fpga semiconductors basic building block. As far as the pin count is concerned, it has 256 pins. Fpga semiconductor typically uses a crystal oscillating at 320MHz. Programs and data can be stored in the 19.3kB memory embedded in this FPGA module. The architecture of the system is based on 676 CLBs. In addition to this, it is also characteriALSO OPERATES WITH 3.3V SUPPLYed by a feature called ALSO OPERATES WITH 3.3V SUPPLY.

LFX200EB-03FN256I Features


160 I/Os
Up to 113664 RAM bits
256 LABs/CLBs

LFX200EB-03FN256I Applications


There are a lot of Lattice Semiconductor Corporation LFX200EB-03FN256I FPGAs applications.

  • Software-defined radio
  • Electronic Warfare
  • Device controllers
  • Embedded Vision
  • Wired Communications
  • Software-defined radios
  • Integrating multiple SPLDs
  • Industrial,Medical and Scientific Instruments
  • Solar Energy
  • Distributed Monetary Systems

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