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LFXP10C-3FN256I

LFXP10C-3FN256I

LFXP10C-3FN256I

Lattice Semiconductor Corporation

1.8V V 2.1mm mm 31.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256

SOT-23

LFXP10C-3FN256I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 320MHz
[email protected] Reflow Temperature-Max (s) 40
Base Part Number LFXP10
Pin Count 256
Number of Outputs 188
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Power Supplies 1.8/2.5/3.3V
Memory Size 31.9kB
Number of I/O 188
RAM Size 27kB
Organization 1216 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 10000
Total RAM Bits 221184
Number of Gates 4
Number of Logic Blocks (LABs) 1250
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 1216
Number of Logic Cells 1216
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $100.00000 $100
500 $99 $49500
1000 $98 $98000
1500 $97 $145500
2000 $96 $192000
2500 $95 $237500
LFXP10C-3FN256I Product Details

LFXP10C-3FN256I Overview


Fpga chips is supplied in the 256-BGA package. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. This device features 188 I/Os in order to transfer data in a more efficient manner. There are 10000 logic elements/cells to form a fundamental building block. In order to operate fpga chips, a voltage supply of 1.8V volts is required. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~3.465V. The XP series FPGA is a type of FPGA that belongs to the XP family of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. A device such as this one has 188 outputs built into it. As a result of space limitations, this FPGA model has been included in Tray. As a whole, it has 256 terminations. Having a RAM bit size of 221184 means that this device will offer you a lot of memory. In order to find related parts, use the part number LFXP10 as a base. For the program to work properly, the RAM si27kBe of this FPGA module must reach 27kB GB in order to ensure normal operation. The device is designed with 256 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. Power is provided by a 1.8/2.5/3.3V battery that is included with the device. Among its basic building blocks, there are 4 gates that are included in it. I am going to present you with a device that is equipped with 256 pins. Its basic building block is composed of 1250 logic blocks (LABs). A memory of 31.9kB is embedded in this FPGA module for storing data and programs. In order to make the architecture work, 1216 CLBs are used. The high efficiency of this device is provided by its 320MHz-frequency operation. During the construction of the building block, there are 1216 logic cells used.

LFXP10C-3FN256I Features


188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)
Operating from a frequency of 320MHz

LFXP10C-3FN256I Applications


There are a lot of Lattice Semiconductor Corporation LFXP10C-3FN256I FPGAs applications.

  • Camera time adjustments
  • Security systems
  • Industrial IoT
  • Ecosystem
  • DO-254
  • Electronic Warfare
  • Secure Communication
  • Aerospace and Defense
  • Embedded Vision
  • Software-defined radios

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