LFXP2-30E-5FN484I Overview

In the 484-BBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Its 363 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 29000 logic elements/cells are required. Fpga chips is powered from a supply voltage of 1.2V. There is a Field Programmable Gate Arrays family component in this FPGA part. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . An FPGA belonging to the XP2 series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In order to make this device as versatile as possible, there are 363 different outputs included. In order to save space, this FPGA model has been contained in Tray. The total number of terminations is 484. Fpga electronics is worth mentioning that this device provides 396288 bfpga electronics s of RAM. In order to find related parts, use the part number LFXP2-30 as a base. For the program to work properly, the RAM si48.4kBe of this FPGA module must reach 48.4kB GB in order to ensure normal operation. In this case, 484 pins are used in the design. This FPGA is built as an array of 3625 LABs/CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. Power is supplied to the device by a 1.21.2/3.33.3V battery. There are a total of 484 pins on this device. Typically, it uses a crystal oscillating at 435MHz in order to operate. Data and programs can be stored in this FPGA module's memory of 55.4kB.

LFXP2-30E-5FN484I Features

363 I/Os
Up to 396288 RAM bits
484 LABs/CLBs

LFXP2-30E-5FN484I Applications

There are a lot of Lattice Semiconductor Corporation LFXP2-30E-5FN484I FPGAs applications.

• Wireless Communications
• Development Boards and Shields for Microcontrollers
• Solar Energy
• Telecommunication
• Distributed Monetary Systems
• Artificial intelligence (AI)
• Defense Applications
• Ecosystem
• Data Mining
• Image processing