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LFXP2-30E-6F672I

LFXP2-30E-6F672I

LFXP2-30E-6F672I

Lattice Semiconductor Corporation

FPGAs XP2 Series 672-BBGA

SOT-23

LFXP2-30E-6F672I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 672-BBGA
Number of Pins 672
Supplier Device Package 672-FPBGA (27x27)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series XP2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Voltage - Supply 1.14V~1.26V
Base Part Number LFXP2-30
Number of I/O 472
RAM Size 48.4kB
Number of Logic Elements/Cells 29000
Total RAM Bits 396288
Number of LABs/CLBs 3625
Number of Logic Blocks (LABs) 3625
RoHS Status Non-RoHS Compliant
Lead Free Lead Free
LFXP2-30E-6F672I Product Details

LFXP2-30E-6F672I Overview


This package is included in the 672-BBGA package and is available for purchase. This device features 472 I/Os in order to transfer data in a more efficient manner. There are 29000 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. The supply voltage of the device is 1.14V~1.26V , at which it runs. It is a type of FPGA belonging to the XP2 seies. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. As a result of space limitations, this FPGA model has been included in Tray. This device is equipped with 396288 RAM bits in terms of its RAM si396288e. In order to find related parts, use the part number LFXP2-30 as a base. This FPGA module has a RAM si48.4kBe of 48.4kB that is sufficient to make sure that the program is able to run normally. The device is designed with 672 pins in total. An array of 3625 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. In order to achieve -40°C, the operating temperature must be higher than -40°C. Fpga semiconductor consists of 3625 logic blocks (LABs). There is a device package provided by 672-FPBGA (27x27) as its supplier.

LFXP2-30E-6F672I Features


472 I/Os
Up to 396288 RAM bits
672 LABs/CLBs
100°C gates
3625 logic blocks (LABs)

LFXP2-30E-6F672I Applications


There are a lot of Lattice Semiconductor Corporation LFXP2-30E-6F672I FPGAs applications.

  • Telecommunication
  • ASIC prototyping
  • Server Applications
  • Scientific Instruments
  • Data Center
  • Aerospace and Defense
  • Security systems
  • Device controllers
  • Software-defined radio
  • Automotive advanced driver assistance systems (ADAS)

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