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FGG.1B.308.CYCD52Z

  • FGG.1B.308.CYCD52Z
  • FGG.1B.308.CYCD52Z

FGG.1B.308.CYCD52Z

FGG.1B.308.CYCD52Z

LEMO

Plug, Male PinsBrassFree Hanging (In-Line)8 PositionsCrimpGoldChromeBulkGPush-Pull

SOT-23

FGG.1B.308.CYCD52Z Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Material NOT SPECIFIED
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Shell Material Brass
Insert Material Polyetheretherketone (PEEK)
Backshell Material, Plating Brass, Chrome
Operating Temperature -55°C~250°C
Packaging Bulk
Series 1B
Feature Backshell
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
Connector Type Plug, Male Pins
Number of Positions 8
Color Silver
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Orientation G
Shielding Shielded
Ingress Protection IP50 - Dust Protected
Current Rating 5A
Shell Finish Chrome
Shell Size - Insert 308
Contact Style Pin
Plating Brass, Chrome
Cable Opening 0.165 ~ 0.205 (4.20mm ~ 5.20mm)
Diameter 12mm
Length 43mm
Contact Finish Thickness - Mating 39.4μin 1.00μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Ratings IP50
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $50.90000 $50.9
500 $50.391 $25195.5
1000 $49.882 $49882
1500 $49.373 $74059.5
2000 $48.864 $97728
2500 $48.355 $120887.5
FGG.1B.308.CYCD52Z Product Details

FGG.1B.308.CYCD52Z Overview


The packaging contains Plug, Male Pins.There is a Free Hanging (In-Line) mounting type for the device.To package the product, we use a Bulk case.This is from the 1B Series.In many ways, its Backshell feature makes it more powerful.Free Hanging is mounting the part.Devices operate at -55°C~250°C operating temperatures.

FGG.1B.308.CYCD52Z Features


1B series

FGG.1B.308.CYCD52Z Applications


There are a lot of LEMO FGG.1B.308.CYCD52Z Circular Connectors applications.

  • Variable speed/frequency drivers
  • Datacom
  • Instrumentation
  • Measuring & Control Technology
  • Blowers
  • All Electrical Machinery
  • Embedded systems
  • Electrical substations
  • Data Technology
  • Telecommunications

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